仕様
データシートの要点
MAZO データシート MST dimension summary from ALNP-48-7-5 drawing A0、改訂 A0 summary
価格と納期
- 最小発注数量
- 10 個
- 発注単位
- 1 個
- 在庫状況
- 確認中
- 供給納期
- 確認中
供給納期は輸送日数とは別です。MST がお届け先ごとの配送スケジュールを確認します。
数量とメールアドレスを送信して見積を依頼してください。ご注文前に、MST が空き状況、最終価格、納入条件をメールで確認します。
選定と用途
選定のポイント
What is supplied
An empty package body for die attach and wire bonding. A test socket makes temporary contact with an already packaged IC; a breakout adapter connects a packaged IC to a board. Neither replaces this empty package.
Will my bare die fit
Check die size and thickness, adhesive thickness, bond-pad layout, wire-loop height, cavity clearance and the lid with your assembly provider. The nominal die-attach area is not a guaranteed maximum die size.
Which bonding process
The current A0 drawing specifies die attach at or below 200 C and wire bonding at or below 100 C. Obtain a confirmed process window for your equipment and materials. Gold-wire trials were reported; aluminium and copper wire compatibility is not established.
Can I request 10 pieces
Yes. Start with the model, quantity, delivery country, die dimensions and whether a lid is needed. Final pricing, available quantity and dispatch date are confirmed in the quotation.
Need a smaller package
Share the required connection count and die/bond-pad layout. A smaller cavity package may shorten wire lengths, but pin count, clearances and assembly access still need checking.
Drawing and photo
The Dimensions tab is an MST dimension summary based on the manufacturer's A0 drawing. It is not a product photograph, PCB footprint or manufacturing drawing. Request the current manufacturer drawing before assembly.