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ALNC-48-7-5C

ALNC-48-7-5C empty htcc ceramic qfn48 package, 7.00 x 7.00 mm

Marca
上海芯陶微

Especificaciones

Manufacturer modelALNC-48-7-5C
TypeEmpty HTCC ceramic QFN48 package
Body size7.00 x 7.00 mm
Connection count48
Pitch0.5 mm
Cavity depth0.5 mm
Body thickness0.8 mm
Nominal die-attach area5.00 x 5.00 mm
Body materialAlumina (Al2O3), HTCC
Closure processAuSn eutectic; lid and sealing quoted separately
Product familyEmpty Ic Packages
Public SKUALNC-48-7-5C
Display descriptionALNC-48-7-5C empty htcc ceramic qfn48 package, 7.00 x 7.00 mm
Commercial modeProduct RFQ / MST confirms requirements and final quotation before order acceptance
MOQ1
Price noteNo checkout price or stock is claimed; MST confirms configuration, MOQ, lead time and final USD quote after review.
Target buyersFab-adjacent buyers: design houses, semiconductor startups, equipment vendors and suppliers entering fab supply chains.

Datos de la hoja técnica

Hoja de datos de MAZO MST dimension summary: ALNC-48-7-5C, revisión 2026-10

Precio y plazo

Precio a consultar
Pedido mínimo
1 pieza
Múltiplo de pedido
1 pieza
Disponibilidad
Por confirmar
Plazo de suministro
Por confirmar

El plazo de suministro no incluye el transporte. MST confirma el calendario de entrega según el destino.

Mínimo de 1 piezas; pida en múltiplos de 1.

Envíe su cantidad y correo electrónico para solicitar una cotización. MST confirmará disponibilidad, precio final y condiciones de entrega antes del pedido.

Pedir cotización

Solo necesitamos su correo; la referencia y la cantidad ya están incluidas.

Añadir empresa, país/región o nota del proyecto (opcional)

Opcional; puede añadirlo más tarde. No envíe archivos de diseño confidenciales por este formulario.

Selección y uso

Cómo seleccionar

What is supplied

Empty HTCC ceramic QFN48 package. Die, lid, bonding wire and assembly services are separate.

Dimension check

The nominal body is 7.00 x 7.00 mm. The die-attach area is 5.00 x 5.00 mm; check die thickness, wire-loop height and assembly clearance.

Ceramic versus plastic

This alumina HTCC package has a 5 x 5 mm die area and 0.5 mm cavity depth. Its AuSn sealing process differs from an adhesive-sealed LCP body. Hermetic performance requires a qualified lid and completed assembly test.

Quantity and delivery

Send the exact model, required quantity, destination and target date. The RFQ form accepts requests from one piece; the supply minimum, available quantity, price and delivery date are confirmed in the quotation.

Drawing and compatibility

The dimension diagram is an MST schematic from the manufacturer numeric table, not a photograph, PCB footprint or manufacturing drawing. Ask for the current model drawing before ordering.

Aplicaciones típicas

  • Use the current manufacturer drawing to confirm dimensions, tolerances and process compatibility.
  • The RFQ quantity is a requested quantity, not a promise of available stock or a confirmed manufacturer minimum.