Empty IC packages provide a cavity and terminals for bare-die assembly. Select the body size, terminal count, pitch, die-attach area, cavity depth and lid together with your assembly provider. These are unpopulated packages for die attach and wire bonding; test sockets and soldered breakout adapters serve different jobs. Request a quotation for the exact model, quantity and delivery destination.
Mostrando 1–43 de 43
ALNP-48-7-5 encapsulado QFN48 LCP vacío, 7 x 7 mm
48 terminals on a 7 x 7 mm body, with 0.5 mm terminal pitch. · 5.2 x 5.2 mm nominal die-attach area and 0.65 mm cavity depth. · Small-quantity sourcing from the manufacturer; price and delivery confirmed per quotation.
ALNP-8-3-6.5 empty plastic qfn package, 3.00 x 3.00 mm
ALNP-8-3-6.5 · 3.00 x 3.00 mm. · connection count 8; pitch 0.65 mm; cavity depth 0.65 mm; nominal die-attach area 1.36 x 1.36 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-12-3-5 empty plastic qfn package, 3.00 x 3.00 mm
ALNP-12-3-5 · 3.00 x 3.00 mm. · connection count 12; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 1.36 x 1.36 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-12-3-6.5 empty plastic qfn package, 3.00 x 3.00 mm
ALNP-12-3-6.5 · 3.00 x 3.00 mm. · connection count 12; pitch 0.65 mm; cavity depth 0.65 mm; nominal die-attach area 1.36 x 1.36 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-16-3-5 empty plastic qfn package, 3.00 x 3.00 mm
ALNP-16-3-5 · 3.00 x 3.00 mm. · connection count 16; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 1.36 x 1.36 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-12-4-6.5 empty plastic qfn package, 4.00 x 4.00 mm
ALNP-12-4-6.5 · 4.00 x 4.00 mm. · connection count 12; pitch 0.65 mm; cavity depth 0.65 mm; nominal die-attach area 2.30 x 2.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-16-4-6.5 empty plastic qfn package, 4.00 x 4.00 mm
ALNP-16-4-6.5 · 4.00 x 4.00 mm. · connection count 16; pitch 0.65 mm; cavity depth 0.65 mm; nominal die-attach area 2.30 x 2.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-20-4-5 empty plastic qfn package, 4.00 x 4.00 mm
ALNP-20-4-5 · 4.00 x 4.00 mm. · connection count 20; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 2.30 x 2.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-24-4-5 empty plastic qfn package, 4.00 x 4.00 mm
ALNP-24-4-5 · 4.00 x 4.00 mm. · connection count 24; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 2.30 x 2.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-28-4-4 empty plastic qfn package, 4.00 x 4.00 mm
ALNP-28-4-4 · 4.00 x 4.00 mm. · connection count 28; pitch 0.4 mm; cavity depth 0.65 mm; nominal die-attach area 2.30 x 2.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-28-5-5 empty plastic qfn package, 5.00 x 5.00 mm
ALNP-28-5-5 · 5.00 x 5.00 mm. · connection count 28; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 3.30 x 3.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-32-5-5 empty plastic qfn package, 5.00 x 5.00 mm
ALNP-32-5-5 · 5.00 x 5.00 mm. · connection count 32; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 3.30 x 3.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-32-5-5H empty plastic qfn package, 5.00 x 5.00 mm
ALNP-32-5-5H · 5.00 x 5.00 mm. · connection count 32; pitch 0.5 mm; cavity depth 1.25 mm; nominal die-attach area 3.30 x 3.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-40-5-4 empty plastic qfn package, 5.00 x 5.00 mm
ALNP-40-5-4 · 5.00 x 5.00 mm. · connection count 40; pitch 0.4 mm; cavity depth 0.65 mm; nominal die-attach area 3.30 x 3.30 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-36-6-5 empty plastic qfn package, 6.00 x 6.00 mm
ALNP-36-6-5 · 6.00 x 6.00 mm. · connection count 36; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 4.24 x 4.24 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-40-6-5H empty plastic qfn package, 6.00 x 6.00 mm
ALNP-40-6-5H · 6.00 x 6.00 mm. · connection count 40; pitch 0.5 mm; cavity depth 1.25 mm; nominal die-attach area 4.24 x 4.24 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-40-6-5F empty plastic qfn package, 6.00 x 6.00 mm
ALNP-40-6-5F · 6.00 x 6.00 mm. · connection count 40; pitch 0.5 mm; cavity depth 0.25 mm; nominal die-attach area 4.24 x 4.24 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-24-7-10 empty plastic qfn package, 7.00 x 7.00 mm
ALNP-24-7-10 · 7.00 x 7.00 mm. · connection count 24; pitch 1 mm; cavity depth 0.65 mm; nominal die-attach area 5.20 x 5.20 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-44-7-5 empty plastic qfn package, 7.00 x 7.00 mm
ALNP-44-7-5 · 7.00 x 7.00 mm. · connection count 44; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 5.20 x 5.20 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-48-7-5H empty plastic qfn package, 7.00 x 7.00 mm
ALNP-48-7-5H · 7.00 x 7.00 mm. · connection count 48; pitch 0.5 mm; cavity depth 1.25 mm; body thickness 1.45 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-32-8-8 empty plastic qfn package, 8.00 x 8.00 mm
ALNP-32-8-8 · 8.00 x 8.00 mm. · connection count 32; pitch 0.8 mm; cavity depth 0.65 mm; nominal die-attach area 6.04 x 6.04 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-56-8-5H empty plastic qfn package, 8.00 x 8.00 mm
ALNP-56-8-5H · 8.00 x 8.00 mm. · connection count 56; pitch 0.5 mm; cavity depth 1.25 mm; nominal die-attach area 6.04 x 6.04 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-44-9-6.5 empty plastic qfn package, 9.00 x 9.00 mm
ALNP-44-9-6.5 · 9.00 x 9.00 mm. · connection count 44; pitch 0.65 mm; cavity depth 0.65 mm; nominal die-attach area 6.90 x 6.90 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-64-9-5H empty plastic qfn package, 9.00 x 9.00 mm
ALNP-64-9-5H · 9.00 x 9.00 mm. · connection count 64; pitch 0.5 mm; cavity depth 1.25 mm; nominal die-attach area 6.90 x 6.90 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-72-10-5 empty plastic qfn package, 10.00 x 10.00 mm
ALNP-72-10-5 · 10.00 x 10.00 mm. · connection count 72; pitch 0.5 mm; cavity depth 0.65 mm; nominal die-attach area 7.80 x 7.80 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-88-10-4 empty plastic qfn package, 10.00 x 10.00 mm
ALNP-88-10-4 · 10.00 x 10.00 mm. · connection count 88; pitch 0.4 mm; cavity depth 0.65 mm; nominal die-attach area 7.80 x 7.80 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-96-10-4 empty plastic qfn package, 10.00 x 10.00 mm
ALNP-96-10-4 · 10.00 x 10.00 mm. · connection count 96; pitch 0.4 mm; cavity depth 0.65 mm; nominal die-attach area 7.80 x 7.80 mm. · Price, supply minimum and lead time confirmed by quote.
ALNP-100-12-4H empty plastic qfn package, 12.00 x 12.00 mm
ALNP-100-12-4H · 12.00 x 12.00 mm. · connection count 100; pitch 0.4 mm; cavity depth 1.25 mm; nominal die-attach area 9.00 x 9.00 mm. · Price, supply minimum and lead time confirmed by quote.
CSMD-2-0.1 empty htcc csmd ceramic package, 6.00 x 3.50 mm
CSMD-2-0.1 · 6.00 x 3.50 mm. · body thickness 2.8 mm; nominal die-attach area 2.40 x 2.40 mm. · Price, supply minimum and lead time confirmed by quote.
CSMD-2-0.2 empty htcc csmd ceramic package, 7.95 x 5.50 mm
CSMD-2-0.2 · 7.95 x 5.50 mm. · body thickness 2.45 mm; nominal die-attach area 3.20 x 3.00 mm. · Price, supply minimum and lead time confirmed by quote.
CSMD-2-0.3 empty htcc csmd ceramic package, 8.00 x 6.00 mm
CSMD-2-0.3 · 8.00 x 6.00 mm. · body thickness 4.2 mm; nominal die-attach area 4.50 x 4.50 mm. · Price, supply minimum and lead time confirmed by quote.
CSMD-3-0.5 empty htcc csmd ceramic package, 10.20 x 7.50 mm
CSMD-3-0.5 · 10.20 x 7.50 mm. · body thickness 3 mm; nominal die-attach area 5.40 x 4.05 mm. · Price, supply minimum and lead time confirmed by quote.
CSMD-3-1.0 empty htcc csmd ceramic package, 15.88 x 11.43 mm
CSMD-3-1.0 · 15.88 x 11.43 mm. · body thickness 3.2 mm; nominal die-attach area 8.40 x 8.20 mm. · Price, supply minimum and lead time confirmed by quote.
CSOP-08B empty htcc csop ceramic package, 11.00 x 11.00 mm
CSOP-08B · 11.00 x 11.00 mm. · connection count 8; nominal die-attach area 3.00 x 2.74 mm. · Price, supply minimum and lead time confirmed by quote.
CSOP-08U empty htcc csop ceramic package, 11.00 x 11.00 mm
CSOP-08U · 11.00 x 11.00 mm. · connection count 8; nominal die-attach area 3.00 x 2.74 mm. · Price, supply minimum and lead time confirmed by quote.
CSOP-10L empty htcc csop ceramic package, 12.50 x 12.25 mm
CSOP-10L · 12.50 x 12.25 mm. · connection count 10; nominal die-attach area 5.75 x 4.25 mm. · Price, supply minimum and lead time confirmed by quote.
CSOP-14 empty htcc csop ceramic package, 16.80 x 15.50 mm
CSOP-14 · 16.80 x 15.50 mm. · connection count 14; nominal die-attach area 4.50 x 2.40 mm. · Price, supply minimum and lead time confirmed by quote.
CSOP-24B empty htcc csop ceramic package, 21.00 x 17.60 mm
CSOP-24B · 21.00 x 17.60 mm. · connection count 24; nominal die-attach area 6.90 x 4.30 mm. · Price, supply minimum and lead time confirmed by quote.
BGA1313-256balls empty bga cavity package, 13.00 x 13.00 mm
BGA1313-256balls · 13.00 x 13.00 mm. · connection count 256; pitch 0.7 mm; cavity depth 3 mm; nominal die-attach area 8.00 x 8.00 mm. · Price, supply minimum and lead time confirmed by quote.
BGA2020-512balls empty bga cavity package, 20.00 x 20.00 mm
BGA2020-512balls · 20.00 x 20.00 mm. · connection count 512; pitch 0.7 mm; cavity depth 3 mm; nominal die-attach area 16.00 x 16.00 mm. · Price, supply minimum and lead time confirmed by quote.
ALNC-144-20-5 empty ic cavity package, 20.00 x 20.00 mm
ALNC-144-20-5 · 20.00 x 20.00 mm. · connection count 144; pitch 0.5 mm; cavity depth 3 mm; nominal die-attach area 16.00 x 16.00 mm. · Price, supply minimum and lead time confirmed by quote.
CQFP144-01 empty ic cavity package, 19.00 x 19.00 mm
CQFP144-01 · 19.00 x 19.00 mm. · connection count 144; pitch 0.5 mm; cavity depth 1.5 mm; nominal die-attach area 12.00 x 12.00 mm. · Price, supply minimum and lead time confirmed by quote.
ALNC-48-7-5C empty htcc ceramic qfn48 package, 7.00 x 7.00 mm
ALNC-48-7-5C · 7.00 x 7.00 mm. · connection count 48; pitch 0.5 mm; cavity depth 0.5 mm; body thickness 0.8 mm. · Price, supply minimum and lead time confirmed by quote.
