Check process, package, test, schedule and non-confidential intake fields before RFQ.

MPW readiness checklist

Prepare a screening brief before NDA, PDK access or partner-approved file exchange.

MPW RFQ without exposing design IP

Start mature-node MPW screening from non-confidential process, die-size, package/test and schedule context. MST routes suitable requests toward RFQ and human confirmation.

从非保密的工艺节点、die 面积、封装测试和排期信息开始成熟节点 MPW 筛查。MST 将合适需求路由到 RFQ 和人工确认。

MPW service access

MPW 服务入口

Mature-node MPW is generally lower-risk than advanced-node tapeout, but every RFQ still passes customer, country, end-use, PDK/NDA, and partner-acceptance screening. No design IP intake before the proper NDA and partner-confirmed route.

成熟节点 MPW 通常比先进工艺流片风险更低，但每条 RFQ 仍需经过客户、国家/地区、最终用途、PDK/NDA 和伙伴准入筛查。在正确 NDA 和伙伴确认路径之前，不接收设计 IP。

Screen whether a request looks suitable for a shared MPW, shuttle, or partner-confirmed tapeout route.

判断需求是否适合 shared MPW、shuttle 或由伙伴确认的 tapeout 路径。

Collect requirements for mature logic, analog/mixed-signal, RF, high-voltage, BCD/power, eNVM/eFlash, sensor, MEMS, or packaging-related routes.

收集成熟逻辑、模拟/混合信号、RF、高压、BCD/电源、eNVM/eFlash、传感器、MEMS 或封装相关路线需求。

Identify the likely agreement path before confidential PDK or design-rule material is shared.

在共享保密 PDK 或设计规则资料前，先确认大致需要哪类协议路径。

Clarify package, assembly, test-board, sample, and delivery expectations before quotation.

报价前澄清封装、组装、测试板、样品数量和交付预期。

Public RFQ intake is open for non-confidential screening. Schedule windows, PDK/NDA path, availability, and quotation are confirmed case by case after requirement review.

公开 RFQ 入口接收非保密需求筛查。排期窗口、PDK/NDA 路径、可用性和报价均在需求审核后逐案确认。

For BCD and power-management prototype requirements where voltage, package/test and sample assumptions need partner-confirmed screening.

面向 BCD 与电源管理原型需求，需对电压、封装/测试和样品假设做伙伴确认筛查。

For embedded non-volatile memory and mixed-signal prototype RFQs that can start with a high-level non-confidential brief.

面向嵌入式非易失存储和混合信号原型 RFQ，可先用高层级非保密 brief 启动。

For RF, high-speed and mixed-signal prototype screening where process fit, PDK/NDA and package/test scope must be checked before routing.

面向 RF、高速和混合信号原型筛查，在路由前需确认工艺适配、PDK/NDA 和封装/测试范围。

For low-power BCD and power-management inquiries that need node, voltage, die-area, schedule and end-use review.

面向低功耗 BCD 与电源管理询价，需审核节点、电压、die 面积、排期和最终用途。

For logic or embedded-Flash prototype needs where MST can prepare a reviewable RFQ before design IP exchange.

面向 logic 或 embedded-Flash 原型需求，MST 可在设计 IP 交换前准备可评审 RFQ。

For customers evaluating 40nm logic, low-power or embedded-Flash prototype routes. Partner acceptance and schedule fit are required.

面向评估 40nm logic、低功耗或 embedded-Flash 原型路线的客户，需伙伴准入和排期适配确认。

No public slot, pricing, or route guarantee; customer, country, end-use, partner, and PDK/NDA review required.

不公开承诺 slot、价格或路线；需客户、国家/地区、最终用途、伙伴准入和 PDK/NDA 审核。

Collect high-level requirements and target constraints without receiving design IP.

只收高层需求和约束条件，不接收设计 IP。

Check whether node, design type, die area, package/test needs, and country profile are routeable.

检查节点、设计类型、面积、封测需求和国家/地区是否可路由。

Identify the correct PDK access path, NDA requirement, and readiness gaps.

确认 PDK 获取路径、NDA 要求和准备缺口。

Route qualified requests to a manufacturing, shuttle, packaging, or test partner for human confirmation.

将合格需求转给制造、shuttle、封装或测试伙伴人工确认。

No GDS, netlist, RTL, source code or confidential design database is accepted at intake. Sensitive end uses, restricted parties and unclear shipment routes require manual review.

入口阶段不接收 GDS、网表、RTL、源代码或机密设计数据库。敏感用途、受限主体和不清晰运输路径需要人工复核。

Translate die, pad, sample and use-case constraints into a package/test RFQ brief.

把 die、pad、样品和应用约束整理成可报价的封测 RFQ。

Clarify wafer output, die count assumptions, bare-die handling, packing and shipment needs.

澄清晶圆输出、die 数量假设、裸 die 处理、包装和运输需求。

Separate wafer probe, packaged test, load-board and socket needs before partner quotation.

报价前区分 wafer probe、封装后测试、load board 和 socket 需求。

Submit package target, die size range, sample count and validation needs.

提交封装目标、die 尺寸区间、样品数量和验证需求。

MST checks whether assumptions are quote-ready or need partner clarification.

MST 判断假设是否可报价，或是否需要伙伴进一步澄清。

Qualified requests are routed for case-by-case package, test and logistics confirmation.

合格需求进入逐案封装、测试和物流确认。

Select all that apply; a rough target is enough.

可多选；初期给大致目标即可。

This is an outline-first RFQ. Do not submit confidential design IP at intake. Export-controlled or restricted technical content is held for manual review.

这是 outline-first RFQ。入口阶段不要提交机密设计 IP。受出口管制或受限技术内容进入人工复核。

Classify what can be quoted as design support, layout support, review, or partner introduction.

区分可作为设计支持、版图支持、review 或伙伴介绍处理的范围。

Identify likely gaps before MPW: PDK/NDA, DRC/LVS, package/test, schedule and ownership.

识别 MPW 前可能的缺口：PDK/NDA、DRC/LVS、封测、排期和责任边界。

Confidential design detail is exchanged only after the proper NDA and engagement scope.

机密设计细节仅在正确 NDA 和合作范围之后交换。

Shipment and re-spin requests are screened for customer, country, end use, restricted parties and document readiness before routing.

样品运输和 re-spin 请求在路由前先筛查客户、国家/地区、最终用途、受限主体和文件准备状态。

Clarify what is moving, where it is going, and which documents may be required.

澄清运输对象、目的地和可能需要的文件。

Separate bring-up feedback, design-change timing, package/test deltas and next-run assumptions.

区分 bring-up 反馈、设计修改时间、封测差异和下一轮假设。

Screen whether a small engineering lot or next MPW path is more appropriate.

筛查小工程批或下一次 MPW 哪个路径更合适。

Sourcing requests may require country, customer, end-use, supplier, import/export, payment and logistics review. MST does not confirm availability, final price, supplier acceptance or export status until human review is complete.

采购需求可能需要客户、国家/地区、最终用途、供应商、进出口、付款和物流复核。MST 在人工审核完成前不确认可供性、最终价格、供应商接受或出口状态。

MPW service requests stay on the MPW readiness and tapeout RFQ path; this page captures non-MPW sourcing needs.

MPW service 仍走 MPW readiness 与流片 RFQ 路径；本页承接非 MPW 采购需求。

Store goods that can be bought directly stay in the catalog and checkout flow; this page captures items that need manual sourcing.

可直接购买的 Store goods 继续走目录和结账流程；本页承接需要人工采购的物料。

MST normalizes loose BOM, drawing, substitute, supplier and cross-border requirements into a sourcing packet for operator review.

MST 将零散 BOM、图纸、替代型号、供应商和跨境要求整理成运营可审核的采购需求包。

Collect buyer identity, request type, product scope, quantity, timeline, destination and constraints.

收集买家身份、需求类型、产品范围、数量、时间、目的地和约束。

Separate direct-buy Store goods, MPW service, and manual sourcing requests so the right path owns the work.

区分直接购买的 Store goods、MPW service 和人工 sourcing，让对应路径负责。

MST reviews missing information, compliance concerns, supplier fit, quotation structure and next questions.

MST 审核缺失信息、合规风险、供应商适配、报价结构和后续问题。

Qualified requests move into sourcing follow-up, supplier quotation or buyer-safe offer preparation.

合格需求进入采购跟进、供应商报价或买家安全报价准备。

Fab	Nodo	Plataforma	Descripción	Booking Deadline	ETO and Data in	Jan	Feb	Mar	Apr	May	Jun	July	Aug	Sep	Oct	Nov	Dec
Fab7	90nm	90nm Low Power BCD	1.5V/5V/5-40V(BCD), 1.5V/5V/5-40V BCD + eFlash	20th/Month	25th/Month	HM427A	—	—	—	—	HM428A	—	—	—	HM429A	—	—
Fab7	90nm	90nm Embedded Nord-Flash	Aggressive 90nm LP, ULL 1.5V/5V(Nord-Flash)	20th/Month	25th/Month	—	HM430A	—	—	—	—	HM431A	—	—	—	HM432A	—
Fab7	55nm	BC55NHSU2	55nm_BiCMOS(SiGe)_High Speed_1.2V/2.5V	5th/Month	10th/Month	—	—	—	—	—	HM442A	—	—	—	—	—	—
Fab9	55nm	BD55NLPUE	55nm_BCD_Low Power_1.2V/5V Vgs, 5V/9V/12V/24V Vds	20th/Month	25th/Month	—	—	—	JM123A	—	—	—	—	—	—	JM124A	—
Fab9	55nm	55nm Logic /55nm Nord-Flash	55nm 1.2V/2.5V(Logic), 55nm 1.2V/5V or 1.2V/2.5V/5V(Nord-Flash)	20th/Month	25th/Month	—	—	JM125A	—	—	JM126A	—	—	JM127A	—	—	JM128A
Fab9	40nm	40nm Logic /40nm Nord-Flash	40nm 1.1V/2.5V(Logic), 40nm 1.1V/5V or 1.1V/2.5V/5V(Nord-Flash)	5th/Month	10th/Month	JM129A	—	—	—	JM130A	—	—	—	JM131A	—	—	—

Need a few chips, not a full production run?

Three questions decide the route

What does the chip do?

How ready is the design?

What must come back?

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HHGrace 2026 MPW Shuttle Schedule

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