Especificaciones
Datos de la hoja técnica
Hoja de datos de MAZO MST dimension summary from ALNP-48-7-5 drawing A0, revisión A0 summary
Precio y plazo
- Pedido mínimo
- 10 piezas
- Múltiplo de pedido
- 1 pieza
- Disponibilidad
- Por confirmar
- Plazo de suministro
- Por confirmar
El plazo de suministro no incluye el transporte. MST confirma el calendario de entrega según el destino.
Envíe su cantidad y correo electrónico para solicitar una cotización. MST confirmará disponibilidad, precio final y condiciones de entrega antes del pedido.
Selección y uso
Cómo seleccionar
What is supplied
An empty package body for die attach and wire bonding. A test socket makes temporary contact with an already packaged IC; a breakout adapter connects a packaged IC to a board. Neither replaces this empty package.
Will my bare die fit
Check die size and thickness, adhesive thickness, bond-pad layout, wire-loop height, cavity clearance and the lid with your assembly provider. The nominal die-attach area is not a guaranteed maximum die size.
Which bonding process
The current A0 drawing specifies die attach at or below 200 C and wire bonding at or below 100 C. Obtain a confirmed process window for your equipment and materials. Gold-wire trials were reported; aluminium and copper wire compatibility is not established.
Can I request 10 pieces
Yes. Start with the model, quantity, delivery country, die dimensions and whether a lid is needed. Final pricing, available quantity and dispatch date are confirmed in the quotation.
Need a smaller package
Share the required connection count and die/bond-pad layout. A smaller cavity package may shorten wire lengths, but pin count, clearances and assembly access still need checking.
Drawing and photo
The Dimensions tab is an MST dimension summary based on the manufacturer's A0 drawing. It is not a product photograph, PCB footprint or manufacturing drawing. Request the current manufacturer drawing before assembly.