Packaging, dicing and test
Scope
Turn prototype wafers into usable samples: dicing, bare-die handling, QFN/BGA/WLCSP, ceramic or open-cavity packages, wafer probe, packaged test, sockets and load boards, and sample shipment. Send the package target, die size and sample count for a quote.
Can help with
Package choice
Die, pad, sample and application needs turned into a package and test specification.
Dicing and bare die
Wafer output, die count, bare-die handling, packing and shipment.
Probe and packaged test
Wafer probe, packaged test, load boards and sockets, each quoted on its own line.
Required input
Package / output
Pick all that apply; a rough target is enough.
Test scope
Sample count
Known constraints
Deliverables
Package and test specification
Open questions before the quote
Quote with lead time
Not accepted
GDS/OASIS, netlists, RTL or other confidential design data
Export and compliance
Some destinations and end uses need export clearance before samples ship.
FAQ
What is Packaging, dicing and test?
Turn prototype wafers into usable samples: dicing, bare-die handling, QFN/BGA/WLCSP, ceramic or open-cavity packages, wafer probe, packaged test, sockets and load boards, and sample shipment. Send the package target, die size and sample count for a quote.
What should I send first?
Package / output, Test scope, Sample count, Known constraints
Can I upload confidential design files here?
Please do not send GDS, netlists, RTL or other confidential design data here.
Which export and compliance rules apply?
Some destinations and end uses need export clearance before samples ship.