
Semiconductor marketplace
Explore by product family and application, then turn a shortlist into an RFQ. MST confirms source evidence, availability, lead time and commercial terms before acceptance.
Product categories
Category SKU previews
MAZO power inductors
Showing 8 preview SKUs with each product image shown once. Open the complete MAZO catalog for all 85 power-inductor SKUs.
MPW sample handling
Showing 3 preview SKUs with each product image shown once. Open the category for all 8 SKUs.
IC test sockets
Showing 7 preview SKUs with each product image shown once. Open the category for all 8 SKUs.
Breakout and evaluation boards
Showing 0 preview SKUs with each product image shown once. Open the category for all 5 SKUs.
Previously shown product images are not repeated here. Open the category to view all 5 SKUs.
SECS/GEM interface hardware
Showing 1 preview SKUs with each product image shown once. Open the category for all 5 SKUs.
Semiconductor prototype services
Mature-node MPW coordination RFQ
mpw-tapeout-rfqJoin a mature-node and specialty-process MPW demand pool before sharing design IP. MST collects high-level RFQs from overseas fabless teams, universities, research labs and industrial chip groups, then screens node fit, process family, die-area range, PDK/NDA path, package/test needs, schedule window, country profile and end use. No GDS, OASIS, netlists, RTL, source code, PDK files or proprietary IP are accepted at intake.
RFQ-based service quotationPackaging, dicing and test RFQ
packaging-test-rfqScope the post-wafer work that turns prototype silicon into usable samples: wafer dicing, bare-die handling, QFN/BGA/WLCSP or ceramic package assumptions, open-cavity needs, socket/load-board expectations, wafer probe, packaged test, sample quantity, shipment, and acceptance criteria. MST does not guarantee package availability, yield, schedule, or final pricing before partner review; we organize a qualified, case-by-case RFQ path after the high-level brief.
Chip design and layout RFQ
chip-design-layout-rfqFor teams that need help before or after MPW scoping: analog/mixed-signal blocks, RF or sensor front-ends, small RTL-to-GDS tasks, layout cleanup, DRC/LVS readiness, PDK/NDA handoff planning, and tapeout-readiness review. Intake is outline-first: share project goals, block type, node target, schedule and engagement scope only. Confidential schematics, source code, netlists, GDS, and PDK-bound material are handled only after the proper NDA path.
Prototype logistics and re-spin RFQ
prototype-logistics-respinCoordinate the operational work after a prototype wafer or sample lot exists: sample shipment, export documents, wafer/sample handling assumptions, re-spin planning, small engineering lots, and transition from first silicon to the next MPW or pilot quantity. MST screens customer, country, end use, shipment path and partner acceptance before any quote path is opened.
Custom sourcing and RFQ coordination
sourcing-rfqSourcing / RFQ intake for requests that are not direct-buy Store goods and not the MPW service. MST turns BOM lists, drawing parts, substitute-model requests, supplier-match needs, Singapore quotation requests and cross-border order constraints into a buyer-safe sourcing packet for operator review. Public intake accepts non-confidential summaries only; detailed drawings, controlled files and supplier-sensitive material should be shared only after MST confirms the correct review path.
RFQ-based sourcing quotationSECS/GEM equipment integration RFQ
secs-gem-integrationRFQ scoping for legacy semiconductor equipment integration: RS-232, ASCII, Modbus, TCP socket or PLC-style equipment bridges toward SECS/GEM HSMS behavior, mapping, simulator/test-bench planning, alarms, events, SVID/ECID and remote commands.
RFQ-based service quotation





















