
MAZO 0.36 µH 50 A shielded power inductor
Brand MAZO
0.36 µH · Isat 50 A · Idc 30 A · DCR ≤ 1.2 mΩ · 11.5 × 10.3 × 4 mm

85 automotive, server and AI power inductors, each with spec table, datasheet and curves. Buy online in USD or request a quote.
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Connect legacy equipment to the fab host with HSMS, SECS-I and an E30 GEM state model for alarms, events and recipes. Licensed per unit and deployed inside your own network.
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Turn your chip idea into a project brief, with process, design and packaging support.
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MST's own edge AI computer with a built-in touch screen. Order a single unit for evaluation.
See the E5200
MAZO 0.36 µH 50 A shielded power inductor
Brand MAZO
0.36 µH · Isat 50 A · Idc 30 A · DCR ≤ 1.2 mΩ · 11.5 × 10.3 × 4 mm

MAZO 0.1 µH 15 A shielded power inductor
Brand MAZO
0.1 µH · Isat 22 A · Idc 15 A · DCR ≤ 4 mΩ · 4.75 × 4.45 × 2 mm · AEC-Q200

MAZO 0.33 µH 5.7 × 5.4 × 3.0 mm shielded power inductor
Brand MAZO
0.33 µH · Isat 19 A · Idc 16 A · DCR ≤ 5 mΩ · 5.7 × 5.4 × 3 mm · AEC-Q200

MAZO 0.22 µH 24.5 A 75 V shielded power inductor
Brand MAZO
0.22 µH · Isat 40 A · Idc 24.5 A · DCR ≤ 3 mΩ · 7.3 × 6.8 × 3 mm · AEC-Q200

MAZO 0.22 µH 70 A shielded power inductor
Brand MAZO
0.22 µH · Isat 70 A · Idc 37 A · DCR ≤ 0.8 mΩ · 11.5 × 10.3 × 4 mm · AEC-Q200

MAZO VCMA-1350 0.22 µH 48 A shielded power inductor
Brand MAZO
0.22 µH · Isat 85 A · Idc 48 A · DCR ≤ 0.62 mΩ · 13.8 × 12.9 × 5 mm · AEC-Q200

Neuro Box E5200 bare unit
Brand MST
Edge AI device · Bare unit

E5200 + NeuroBox suite
Brand MST
100 TOPS INT8 · 50 TFLOPS FP16 · NVIDIA Orin · 16 GB · 10.1" touch screen built in

Plastronics 16QN50S23030 QFN16 3 × 3 mm 0.5 mm clamshell burn-in / test socket
Brand Plastronics

Enplas OTQ-64-0.5-01 QFP64 0.5 mm 10 × 10 mm open-top test socket
Brand Enplas

Elnec DIL8W/SOIC8 ZIF 150mil programming adapter (SOIC8 to DIL8)
Brand Elnec

Proto-Advantage PA0067 QFN-32 (0.5 mm, 5 × 5 mm) to DIP-32 SMT adapter
Brand Proto-Advantage

Proto-Advantage PA0073 QFN-48 (0.5 mm, 7 × 7 mm) to DIP-48 SMT adapter
Brand Proto-Advantage

Proto-Advantage IPC0032 QFN-64 (0.5 mm, 9 × 9 mm, 3.8 mm pad) to DIP-68 SMT adapter
Brand Proto-Advantage

Proto-Advantage PA0109 TQFP/VQFP-100 (0.5 mm, 14 × 14 mm) to DIP-100 SMT adapter
Brand Proto-Advantage

Proto-Advantage BGA0016 BGA/WLCSP-25 (0.4 mm, 5 × 5 grid) to DIP-25 SMT adapter
Brand Proto-Advantage
MPW SERVICEMature-node MPW shuttleSubmit requirement Shared-wafer (MPW) runs on mature and specialty processes: 350nm to 40nm, BCD, SiGe, eFlash, RF and high-voltage. Tell us the node, die size, package and test needs and your target window; we reply with fit, schedule and a quote. No design files are needed to start.
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Price by quoteTurn prototype wafers into usable samples: dicing, bare-die handling, QFN/BGA/WLCSP, ceramic or open-cavity packages, wafer probe, packaged test, sockets and load boards, and sample shipment. Send the package target, die size and sample count for a quote.
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