Singapore
MST engineering selection desk

Do not guess a part number. Start with the power-stage conditions.

Start from the application, topology and failure boundaries. Screen MAZO candidate families, then carry the Irms, Isat, loss, thermal, EMI and qualification checks into sample and RFQ review.

Start candidate screening View all MAZO SKUs
The selector does not collect names, email or customer project names. Final design-in and commercial terms are human-reviewed.
01TopologyBuck / SEPIC / PoC / CMC
02Current & lossIrms / Isat / DCR / core
03EnvironmentHeat / height / EMI / grade
04Sample & RFQEvidence / lead time / quote

Power-inductor selection starts with four questions

Irms or Isat—which matters?

Both. Irms constrains copper loss and temperature rise; Isat constrains inductance roll-off at peak current. Rating definitions and test conditions remain part-specific.

Is lower DCR always better?

Lower DCR reduces I²R copper loss, but size, cost, winding construction and core loss still trade off—especially as switching frequency rises.

Why start with topology?

Buck, SEPIC, Class-D, PoC and common-mode filtering have different current waveforms and critical curves. Searching by inductance alone can produce the wrong family.

Can the selector finalize a part?

No. It narrows the search space to candidate families. Final selection still requires controller equations, the complete datasheet, simulation or samples and board validation.

Six-step method: from circuit conditions to a purchasable specification

  1. 01

    Define topology and operating points

    Capture input/output range, load, phase count, switching frequency and conduction mode.

  2. 02

    Calculate ripple and peak current

    Use the controller vendor’s equations. For a buck stage, peak current is commonly load current plus half the inductor ripple current.

  3. 03

    Check Irms and Isat separately

    Irms is a thermal constraint; Isat addresses saturation and inductance reduction at peak current. Do not substitute one rating for the other.

  4. 04

    Estimate copper and core loss

    Copper loss begins with I²R. At higher frequency, include AC winding and core loss instead of comparing DCR alone.

  5. 05

    Apply mechanical and environmental limits

    Include height, footprint, land pattern, shielding, sensitive neighbors, airflow, ambient, vibration and qualification path.

  6. 06

    Validate samples and form the RFQ

    Lock the datasheet revision and alternate envelope; validate efficiency, temperature rise, ripple, transient and EMI; then confirm samples, price, lead time and source evidence.

01ΔIL ≈ (Vin − Vout) × Ton / LIdealized CCM buck ripple screen; use the controller documentation as the authority.
02Ipeak ≈ Iout + ΔIL / 2Use peak current to check saturation margin and inductance roll-off.
03PDC ≈ Irms2 × DCRThis is only the copper-loss starting point; add AC winding and core loss.
Explainable candidate screening

Screen the family from operating conditions, then verify the part number

Start with the application; general-power and BOM-alternate requests also need a topology. More operating detail makes the handoff and verification checklist more actionable. Do not enter customer names or confidential project data.

Most important design constraints (select any)
Add engineering parameters for a more actionable handoff

The result will not pretend to be a final design-in

MST returns candidate families, match reasons, representative SKUs and the failure boundaries that still require verification.

Continue by product design

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Automotive audio, SEPIC, CMC, PoC and NR inductors

MAZO RFQ path for non-standard power and EMI magnetic components including Class-D audio inductors, 1080 SEPIC inductors, common-mode chokes, PoC inductors and NR shielded inductors. MST uses AI to route the buyer from application symptoms to a safe SKU or sourcing brief before formal quote confirmation.

View application, buyer roles and representative SKUs
Engineering basis

Sources and boundaries are visible

Equation and rating guidance comes from public engineering material published by semiconductor and magnetic-component manufacturers. MAZO candidate mapping uses MST-curated product material. The current part-specific datasheet, samples and project validation remain authoritative.