MPW service access

Join a mature-node and specialty-process MPW demand pool before sharing design IP. MST collects high-level RFQs from overseas fabless teams, universities, research labs and industrial chip groups, then screens node fit, process family, die-area range, PDK/NDA path, package/test needs, schedule window, country profile and end use. No GDS, OASIS, netlists, RTL, source code, PDK files or proprietary IP are accepted at intake.

Scope the post-wafer work that turns prototype silicon into usable samples: wafer dicing, bare-die handling, QFN/BGA/WLCSP or ceramic package assumptions, open-cavity needs, socket/load-board expectations, wafer probe, packaged test, sample quantity, shipment, and acceptance criteria. MST does not guarantee package availability, yield, schedule, or final pricing before partner review; we organize a qualified, case-by-case RFQ path after the high-level brief.

Coordinate the operational work after a prototype wafer or sample lot exists: sample shipment, export documents, wafer/sample handling assumptions, re-spin planning, small engineering lots, and transition from first silicon to the next MPW or pilot quantity. MST screens customer, country, end use, shipment path and partner acceptance before any quote path is opened.