MPW readiness checklist
What to prepare before sending an MPW inquiry. Nothing confidential needed.
Safe to share now
- Target node and process family.
- Rough die area, package preference and sample quantity.
- PDK/NDA status (no PDK files).
- Country, schedule and a short end-use summary.
Do not share publicly
- GDS, OASIS, netlists, RTL, source code or scripts.
- PDK files, design-rule screenshots or confidential foundry documents.
- Detailed schematics or block diagrams that reveal your IP.
- Confidential customer or program names.
Before you send
Five details that save a round of questions
- Node/process: 90 nm BCD, 55 nm eFlash, 40 nm low-power logic, or not sure.
- Design type: analog, mixed-signal, RF, high-voltage, embedded memory, sensor, MEMS, logic or other.
- Die and samples: rough area in mm², bare die or packaged, sample quantity.
- Package/test: QFN, BGA, WLCSP, wafer probe, packaged test or reliability.
- Schedule and use: country, target date, PDK/NDA status and end use.
Example message
Project: industrial sensor ASIC, civil end use Node/process: 90 nm BCD preferred, open to advice Die estimate: 5–20 mm²; samples: 25–100 packaged units Package/test: QFN preferred, wafer probe and basic packaged test PDK/NDA: no PDK access yet Files: none attached (no GDS, netlists, RTL or PDK)