MPW readiness checklist
Use this as a non-confidential pre-screen before sending an MPW coordination RFQ. It is not a foundry acceptance promise.
Safe to share now
- Target mature-node class and process family.
- Estimated die area range, package preference and sample count.
- PDK/NDA status without uploading PDK files.
- Country, customer type, schedule window and non-sensitive end-use summary.
Do not share publicly
- GDS, OASIS, netlists, RTL, source code or scripts.
- PDK files, design-rule screenshots or confidential foundry documents.
- Proprietary schematics, full block diagrams with IP detail or controlled technical files.
- Customer-confidential program names before the right agreement path is confirmed.
Pre-RFQ packet
Five fields that prevent first-round back-and-forth
- Node/process: 180nm BCD, 130nm mixed-signal, 65/55nm logic, 40nm RF, or not sure.
- Design class: analog, mixed-signal, RF, HV, eNVM, sensor, MEMS, logic or other.
- Die and samples: estimated mm2 range, bare die vs package, expected sample quantity.
- Package/test: QFN, BGA, WLCSP, wafer probe, packaged test, reliability or load-board needs.
- Commercial path: country, customer type, target date, PDK/NDA state and end-use summary.
Non-confidential brief example
Project: industrial sensor ASIC, no defense end use Node/process: 180nm or 130nm mixed-signal, BCD helpful but not mandatory Die estimate: 5-20 mm2; samples: 25-100 packaged units Package/test: QFN preferred, wafer probe and basic packaged test needed PDK/NDA: no PDK access yet; NDA path needed Files: no GDS, no netlists, no RTL, no PDK, no controlled technical files