Packaging & Assembly Materials

Bonding Wire / Die Attach Adhesives. Price, availability, exact configuration and delivery are confirmed by quotation.

2 products · priced 0/2 · 0 series guides

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Heraeus Electronics HD5 · Bonding Wire

Material: Au · Gold purity: 4N (99.99%)

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EPO-TEK H20E · Die Attach Adhesives

Mix ratio by weight: 1:1 · Manufacturer reference cure: 150 °C / 1 h · Configuration: 2 components

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Minimum order To be confirmedSupply lead time To be confirmed