Services

Shared-wafer (MPW) runs on mature and specialty processes: 350nm to 40nm, BCD, SiGe, eFlash, RF and high-voltage. Tell us the node, die size, package and test needs and your target window; we reply with fit, schedule and a quote. No design files are needed to start.

For parts that are not in the store: BOM lists, drawing parts, replacements for end-of-life models, supplier search and cross-border purchases. Send a short, non-confidential summary and we reply with a quote or the questions we still need answered.

Turn prototype wafers into usable samples: dicing, bare-die handling, QFN/BGA/WLCSP, ceramic or open-cavity packages, wafer probe, packaged test, sockets and load boards, and sample shipment. Send the package target, die size and sample count for a quote.

Design help before or after an MPW run: analog and mixed-signal blocks, RF and sensor front-ends, small RTL-to-GDS tasks, layout clean-up, DRC/LVS and tapeout checks. Start with goals, block type, node and timing; design files are shared only after an NDA.

After first silicon: sample shipment and export documents, wafer and sample handling, re-spin planning, small engineering lots and the move to the next MPW or a pilot quantity. Tell us the stage, destination and timing for a quote.