Specifications
Datasheet facts
MAZO datasheet MST dimension summary from ALNP-48-7-5 drawing A0, revision A0 summary
Price and lead time
- Minimum order
- 10 pieces
- Order multiple
- 1 piece
- Availability
- To be confirmed
- Supply lead time
- To be confirmed
Supply lead time is separate from shipping transit time. MST confirms the delivery schedule for your destination.
Send your quantity and email to request a quote. MST will confirm availability, final price and delivery terms by email before you order.
Selection and use
How to select
What is supplied
An empty package body for die attach and wire bonding. A test socket makes temporary contact with an already packaged IC; a breakout adapter connects a packaged IC to a board. Neither replaces this empty package.
Will my bare die fit
Check die size and thickness, adhesive thickness, bond-pad layout, wire-loop height, cavity clearance and the lid with your assembly provider. The nominal die-attach area is not a guaranteed maximum die size.
Which bonding process
The current A0 drawing specifies die attach at or below 200 C and wire bonding at or below 100 C. Obtain a confirmed process window for your equipment and materials. Gold-wire trials were reported; aluminium and copper wire compatibility is not established.
Can I request 10 pieces
Yes. Start with the model, quantity, delivery country, die dimensions and whether a lid is needed. Final pricing, available quantity and dispatch date are confirmed in the quotation.
Need a smaller package
Share the required connection count and die/bond-pad layout. A smaller cavity package may shorten wire lengths, but pin count, clearances and assembly access still need checking.
Drawing and photo
The Dimensions tab is an MST dimension summary based on the manufacturer's A0 drawing. It is not a product photograph, PCB footprint or manufacturing drawing. Request the current manufacturer drawing before assembly.