CSOP-10L empty htcc csop ceramic package, 12.50 x 12.25 mm
- Brand
- 上海芯陶微
- Category
- Empty IC packages
Specifications
Datasheet facts
MAZO datasheet MST dimension summary: CSOP-10L, revision 2026-10
Price and lead time
- Minimum order
- 1 piece
- Order multiple
- 1 piece
- Availability
- To be confirmed
- Supply lead time
- To be confirmed
Supply lead time is separate from shipping transit time. MST confirms the delivery schedule for your destination.
Send your quantity and email to request a quote. MST will confirm availability, final price and delivery terms by email before you order.
Selection and use
How to select
What is supplied
Empty HTCC CSOP ceramic package. Die, lid, bonding wire and assembly services are separate.
Dimension check
The nominal overall outline is 12.50 x 12.25 mm. The die-attach area is 5.75 x 4.25 mm; check die thickness, wire-loop height and assembly clearance.
Quantity and delivery
Send the exact model, required quantity, destination and target date. The RFQ form accepts requests from one piece; the supply minimum, available quantity, price and delivery date are confirmed in the quotation.
Drawing and compatibility
The dimension diagram is an MST schematic from the manufacturer numeric table, not a photograph, PCB footprint or manufacturing drawing. Ask for the current model drawing before ordering.