Singapore

Semiconductor marketplace

Shop prototype consumables, MAZO power inductors, sample-handling items, IC sockets and interface hardware. For custom engineering support, MST will follow up with practical next steps.

111 个 SKU5 个分类

产品分类

分类 SKU 预览

111 个 SKU

MAZO power inductors

显示 8 个预览 SKU;本页相同商品图片只展示一次。 进入完整 MAZO 目录查看全部 85 个功率电感 SKU。

查看全部 85 个 MAZO SKU

MPW sample handling

显示 3 个预览 SKU;本页相同商品图片只展示一次。 进入分类页查看全部 8 个 SKU。

查看全部 8 个 SKU

IC test sockets

显示 7 个预览 SKU;本页相同商品图片只展示一次。 进入分类页查看全部 8 个 SKU。

查看全部 8 个 SKU

Breakout and evaluation boards

显示 0 个预览 SKU;本页相同商品图片只展示一次。 进入分类页查看全部 5 个 SKU。

查看全部 5 个 SKU

本页不重复展示已出现的商品图片;请进入分类页查看全部 5 个 SKU。

SECS/GEM interface hardware

显示 1 个预览 SKU;本页相同商品图片只展示一次。 进入分类页查看全部 5 个 SKU。

查看全部 5 个 SKU

Semiconductor prototype services

Mature-node MPW coordination RFQ

mpw-tapeout-rfq

Join a mature-node and specialty-process MPW demand pool before sharing design IP. MST collects high-level RFQs from overseas fabless teams, universities, research labs and industrial chip groups, then screens node fit, process family, die-area range, PDK/NDA path, package/test needs, schedule window, country profile and end use. No GDS, OASIS, netlists, RTL, source code, PDK files or proprietary IP are accepted at intake.

RFQ-based service quotation

Packaging, dicing and test RFQ

packaging-test-rfq

Scope the post-wafer work that turns prototype silicon into usable samples: wafer dicing, bare-die handling, QFN/BGA/WLCSP or ceramic package assumptions, open-cavity needs, socket/load-board expectations, wafer probe, packaged test, sample quantity, shipment, and acceptance criteria. MST does not guarantee package availability, yield, schedule, or final pricing before partner review; we organize a qualified, case-by-case RFQ path after the high-level brief.

Chip design and layout RFQ

chip-design-layout-rfq

For teams that need help before or after MPW scoping: analog/mixed-signal blocks, RF or sensor front-ends, small RTL-to-GDS tasks, layout cleanup, DRC/LVS readiness, PDK/NDA handoff planning, and tapeout-readiness review. Intake is outline-first: share project goals, block type, node target, schedule and engagement scope only. Confidential schematics, source code, netlists, GDS, and PDK-bound material are handled only after the proper NDA path.

Prototype logistics and re-spin RFQ

prototype-logistics-respin

Coordinate the operational work after a prototype wafer or sample lot exists: sample shipment, export documents, wafer/sample handling assumptions, re-spin planning, small engineering lots, and transition from first silicon to the next MPW or pilot quantity. MST screens customer, country, end use, shipment path and partner acceptance before any quote path is opened.

Custom sourcing and RFQ coordination

sourcing-rfq

Sourcing / RFQ intake for requests that are not direct-buy Store goods and not the MPW service. MST turns BOM lists, drawing parts, substitute-model requests, supplier-match needs, Singapore quotation requests and cross-border order constraints into a buyer-safe sourcing packet for operator review. Public intake accepts non-confidential summaries only; detailed drawings, controlled files and supplier-sensitive material should be shared only after MST confirms the correct review path.

RFQ-based sourcing quotation

SECS/GEM equipment integration RFQ

secs-gem-integration

RFQ scoping for legacy semiconductor equipment integration: RS-232, ASCII, Modbus, TCP socket or PLC-style equipment bridges toward SECS/GEM HSMS behavior, mapping, simulator/test-bench planning, alarms, events, SVID/ECID and remote commands.

RFQ-based service quotation