Empty IC packages for prototype assembly
An empty (pre-molded or air-cavity) IC package lets you attach and wire-bond your own die without a full molding line. It is the usual route for MPW samples, sensor and MEMS prototypes, and engineering samples that must fit a standard socket or PCB footprint.
The packages listed on MST Store are made by Shanghai Xintaowei New Materials Co., Ltd. in plastic air-cavity QFN and HTCC ceramic formats.
Plastic air-cavity vs ceramic
| Family | Construction | Typical use |
|---|---|---|
| Plastic air-cavity QFN (ALNP) | LCP plastic body, copper lead frame, nickel-gold plating; JEDEC MO-220 outlines; sealed with a ceramic or plastic lid by adhesive | Fast prototypes and engineering samples that do not need hermetic sealing |
| Ceramic QFN (CQFN / ALNC) | HTCC multilayer ceramic | Hermetic or higher-reliability prototypes |
| CSOP small ceramic packages | HTCC ceramic | Small-outline ceramic prototypes |
| CSMD power packages | HTCC ceramic | Power devices |
| Cavity BGA and CQFP | Cavity package | High pin-count prototypes (144 to 512 I/O) |
The manufacturer notes that plastic air-cavity packages are not hermetic to military grade; choose ceramic when hermeticity is required.
Sizes listed on MST Store
| Part number | Type | Body size |
|---|---|---|
| ALNP-16-3-5 | Plastic air-cavity QFN16 | 3 × 3 mm |
| ALNP-24-4-5 | Plastic air-cavity QFN24 | 4 × 4 mm |
| ALNP-32-5-5 | Plastic air-cavity QFN32 | 5 × 5 mm |
| ALNP-48-7-5 | LCP QFN48, 0.5 mm pitch, 5.2 × 5.2 mm die-attach area, 0.65 mm cavity depth | 7 × 7 mm, 0.85 mm thick |
| ALNP-64-9-5H | Plastic air-cavity QFN64 | 9 × 9 mm |
| ALNP-100-12-4H | Plastic air-cavity QFN100 | 12 × 12 mm |
| ALNC-48-7-5C | HTCC ceramic QFN48 | 7 × 7 mm |
| CSOP-14 | HTCC CSOP ceramic | 16.80 × 15.50 mm |
| BGA1313-256BALLS | Cavity BGA, 256 balls | 13 × 13 mm |
| BGA2020-512BALLS | Cavity BGA, 512 balls | 20 × 20 mm |
More than 40 sizes are listed in the catalogue. Confirm cavity size, die-attach area and bond-pad layout on the drawing before ordering.
How to choose
- Die size plus bonding clearance must fit the cavity or die-attach area.
- Pin count and pitch must match the test socket or PCB footprint you plan to use.
- Choose ceramic if you need hermetic sealing; plastic air-cavity for faster, lower-cost samples.
- Plan the lid: ceramic, metal or plastic lids are available for these packages.
What to send with a package RFQ
- Die size, pad count and bond-pad layout (non-confidential outline is enough to start).
- Preferred package type, body size and pitch.
- Hermetic or non-hermetic requirement and lid type.
- Quantity and whether you also need die attach, wire bonding or test.
Frequently asked questions
What is an empty IC package?
A finished package body with leads or balls and an open cavity, supplied without a die. You attach and wire-bond your own die, then seal it with a lid.
Are plastic air-cavity QFN packages hermetic?
No. The manufacturer states plastic cavity packages are not hermetic to military grade. Use an HTCC ceramic package when hermetic sealing is required.
Do the QFN packages follow a JEDEC outline?
The manufacturer lists its plastic air-cavity QFN packages as standardized to JEDEC MO-220.
Can I request assembly and test as well?
Yes. Use the packaging and test RFQ to describe die attach, wire bonding and test needs; MST reviews the scope and replies with options.
Package your prototype dies
Send the die size, pad count and package preference. MST confirms the package with the manufacturer and replies with price and lead time.
Request a packaging quoteRelated pages
Sources
- Shanghai Xintaowei New Materials, plastic air-cavity packages
- Shanghai Xintaowei New Materials, product centre
Values are taken from the manufacturer documents above, checked 2026-10-22. Specifications can change; confirm against the current datasheet before ordering. MST is a distributor; products are made by the manufacturers named.